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fab-C1206K.kicad_mod 1.47 KiB
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Ben Z Yuan's avatar
kicad: convert fab.mod + add usb micro footprint
Ben Z Yuan committed
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(module fab-C1206K (layer F.Cu) (tedit 200000)
  (descr "CERAMIC CHIP CAPACITOR KEMET 1206 REFLOW SOLDER")
  (tags "CERAMIC CHIP CAPACITOR KEMET 1206 REFLOW SOLDER")
  (attr smd)
  (fp_text reference >NAME (at 0.9398 -1.60782) (layer F.SilkS)
    (effects (font (size 1.016 1.016) (thickness 0.0762)))
  )
  (fp_text value >VALUE (at 1.4478 1.59004) (layer F.SilkS)
    (effects (font (size 1.016 1.016) (thickness 0.0762)))
  )
  (fp_line (start -1.59766 0.79756) (end -1.09982 0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start -1.09982 0.79756) (end -1.09982 -0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start -1.59766 -0.79756) (end -1.09982 -0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start -1.59766 0.79756) (end -1.59766 -0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start 1.09982 0.79756) (end 1.59766 0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start 1.59766 0.79756) (end 1.59766 -0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start 1.09982 -0.79756) (end 1.59766 -0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start 1.09982 0.79756) (end 1.09982 -0.79756) (layer F.SilkS) (width 0.06604))
  (fp_line (start -1.524 -0.7493) (end 1.524 -0.7493) (layer F.SilkS) (width 0.1016))
  (fp_line (start 1.524 0.7493) (end -1.524 0.7493) (layer F.SilkS) (width 0.1016))
  (pad 1 smd rect (at -1.4986 0) (size 1.4986 1.99898) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at 1.4986 0) (size 1.4986 1.99898) (layers F.Cu F.Paste F.Mask))
)